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  Datasheet File OCR Text:
 MUR805 THRU MUR860
GLASS PASSIVATED SUPER FAST RECTIFIERS
PRODUCT SUMMARY
Reverse Voltage 50 to 600 Volts Foward Current 8.0 Amperes
FEATURES
Glass passivated chip Superfast switching time for hight efficiency Low reverse leakage current High surge capacity
TO-220AC
MECHANICAL DATA
Case: TO-220AC full molded plastic package Terminals: Lead solderable per MIL-STD-202, Method 208 Polarity: As marked Standard packaging: Any Weight: 0.08 ounces, 2.24 grams
Pb-free; RoHS-compliant
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Ratings at 25 C ambient temperature unless otherwise specified.)
o
Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100oC Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Operating junction and storage temperature range Notes: 1. Pulse test: Pulse width 300 usec, Duty ccle 2% @TJ=25oC @TJ=125oC
Symbol VRRM VRMS V DC IF(AV) IFSM VF IR trr TJ, TSTG
MUR805 50 35 50
MUR810 100 70 100
MUR820 200 140 200 8.0 125.0
MUR840 400 280 400
MUR860 600 420 600
Unit Volts Volts Volts Amps Amps
1.0 10.0 500 50 -55 to +150
1.3
1.8
Volts uA nS
o
C
03/07/2007 Rev.1.00
www.SiliconStandard.com
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MUR805 THRU MUR860
RATINGS AND CHARACTERISTIC CURVES
(TA = 25oC unless otherwise noted)
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
03/07/2007 Rev.1.00
www.SiliconStandard.com
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